Imitation gold plating needs to simulate the color of gold through the copper-zinc alloy and other materials, the requirements of the plating layer color uniformity, corrosion resistance and have a metallic luster.
Author: Anna
Electroplating imitation gold process technology and equipment selection
I. Process characteristics and equipment selection
Imitation gold plating process requirements
Imitation gold plating needs to simulate the color of gold through the copper-zinc alloy and other materials, the requirements of the plating layer color uniformity, corrosion resistance and have a metallic luster.
Key equipment: High-frequency switching power supply is recommended because of its low output ripple and high precision of current density control, which is suitable for the requirements of fineness and luster of plating layer in the gold-imitation process.
Comparison of rectifier types
Switching power supply:
Advantage: High frequency technology (above 20kHz) reduces energy consumption, improves current stability, and makes the plating layer more detailed in crystallization and stronger in bonding.
Applicable scenarios: imitation gold, precious metals and other precision plating process.
Silicon Controlled Rectifier:
Advantage: wide range of regulation, suitable for high-current scenarios (such as piston ring plating), but the imitation of gold process due to the sensitivity of ripple, less used.
II. Process Parameter Control
Current Density and Voltage Regulation
Gold-imitation plating requires strict control of current density (usually 0.5~2A/dm²) to avoid darkening or reddening of the plated layer.
High-frequency switching power supply supports microsecond response, real-time adjustment of parameters to ensure uniform deposition of plating solution ions.
Plating solution composition and temperature management
The ratio of copper and zinc and the content of additives in the plating solution need to be optimized, combined with the rectifier to stabilize the output and reduce the porosity of the plating layer.
The temperature of the plating solution is usually controlled at 25~35℃, which is too high to cause oxidation and discoloration of the plating layer.
III. Quality Optimization and Efficiency Improvement
Improvement of plating performance
The high frequency power supply can reduce the “dead zone” current in the plating bath, improve the uniformity of the plating layer, and increase the abrasion resistance of the imitation gold layer by more than 30%.
Through the intelligent monitoring system real-time data collection, optimize the process parameters, reduce the defective rate.
Energy saving and environmental protection
High-frequency switching power supply efficiency reaches more than 89%, saving 25~35% power compared with traditional silicon controlled equipment, reducing carbon emissions.
Low ripple output reduces the loss of precious metals (such as copper), saving costs.
IV. Typical case application
Automobile parts imitation gold plating: using high-frequency switching power supply (such as gold-plating power supply rectifier), through the segmented current control to achieve gradient gold effect, and at the same time to meet the requirements of salt spray resistance test.
Decorative gold parts: combined with pulse plating mode to improve the finish of the plated layer and reduce the subsequent polishing process.
Plating imitation gold process needs to give priority to the use of high-frequency switching power supply, through precise control of the current density, plating solution composition and temperature, to achieve a balance between the color and performance of the plating layer. High-frequency equipment in the energy saving, plating quality and intelligent management of significant advantages, is the key to upgrade the imitation gold process.